Embedded Engineer

Senior Embedded Engineer We are looking for a highly experienced Senior Embedded Engineer to join our partner's engineering team and play a key role in the architecture, development and production of high-volume, cost-sensitive microelectronic products. Key Responsibilities: Collaborate closely with Electrical Engineering teams to define product requirements, system specifications, and ASIC/SoC architectures for high-volume, cost-constrained microelectronic applications. Evaluate system-level architectural options and drive technical trade-offs between performance, power, die size, cost, manufacturability, yield, and time-to-market . Lead the technical evaluation, selection, and integration of third-party semiconductor IP, including analog, compute, memory, connectivity, and other relevant IP blocks. Represent the engineering organization in technical discussions with foundries, OSATs, semiconductor IP providers, and manufacturing partners . Support technology roadmap discussions and proactively identify manufacturing, technology, and supply-chain risks. Provide technical input into process-node and PDK selection , considering performance requirements, power consumption, cost, yield, foundry maturity, and production readiness. Drive Design-for-Cost (DfC), Design-for-Manufacturing (DfM), Design-for-Assembly (DfA), and Design-for-Yield (DfY) principles from architecture through production. Guide decisions related to floorplanning, die size, pin count, pin placement, package selection, and assembly strategy , optimizing both technical and commercial outcomes. Develop and contribute to semiconductor cost models covering wafer economics, packaging, OSAT costs, testing, yield, logistics, and other unit-cost drivers . Work closely with test and validation teams to define production-test strategies that maximize fault coverage while minimizing test time and cost. Analyze silicon test results, production data, and yield metrics to identify opportunities for design, manufacturing, and cost optimization. Support root-cause analysis of silicon, manufacturing, and yield issues and drive corrective actions with internal and external stakeholders. Incorporate supply-chain resilience and multi-sourcing considerations into architectural and technology decisions. Evaluate the impact of die size, process-node selection, foundry maturity, packaging, and manufacturing choices on sourcing flexibility and supply-chain risk. Collaborate with cross-functional teams throughout the complete ASIC/SoC lifecycle, from architecture and technology selection to design, tape-out, silicon bring-up, validation, production, and yield optimization . Contribute to continuous improvement of semiconductor design and manufacturing processes, with a strong focus on scalability and high-volume production. Travel internationally as required, including regular travel to Denmark several times per month , as well as periodic travel to Boston, Europe, and Asia , depending on project requirements and candidate location. Required Qualifications & Technical Expertise: 8+ years of relevant experience in ASIC microarchitecture, ASIC design, SoC design, embedded semiconductor development, or a closely related electrical engineering discipline. Demonstrated track record of successfully taking ASIC/SoC products through the complete development lifecycle, including multiple successful tape-outs . Strong understanding of ASIC/SoC architecture and microarchitecture , with the ability to evaluate complex system-level trade-offs and make sound architectural decisions. Hands-on experience evaluating, selecting, and integrating third-party semiconductor IP . Strong understanding of how IP selection and integration decisions influence overall system architecture, performance, cost, and risk. Good knowledge of semiconductor foundry processes, process nodes, and PDKs , including their impact on power, performance, cost, yield, and production readiness. Practical experience with advanced semiconductor packaging and assembly strategies , including their impact on performance, cost, manufacturing, and supply-chain considerations. Strong understanding of semiconductor testing methodologies , including test strategies, fault coverage, test time, and production-test cost optimization. Solid understanding of semiconductor yield fundamentals , including die-size/yield relationships, production-line yield analysis, silicon test data, and yield improvement. Practical experience applying DfC, DfM, DfA, and DfY principles to semiconductor products. Good understanding of wafer economics, OSAT operations, packaging costs, test costs, and semiconductor unit-cost drivers .